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Wave Soldering Machine WSM 350 DC (Carrier Types)

640000.0 INR/Piece

Product Details:

  • Production Capacity 400-800 PCB/Hr
  • Control System PLC with Touch Screen Interface
  • Noise Level <65 dB
  • Frequency 50/60 Hz
  • Accuracy 0.1 mm
  • Connectivity Options RS-232, USB (Optional)
  • Model No WSM 350 DC
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Wave Soldering Machine WSM 350 DC (Carrier Types) Price And Quantity

  • 640000.0 INR/Piece
  • 1 Piece

Wave Soldering Machine WSM 350 DC (Carrier Types) Product Specifications

  • PCB Assembly, Electronic Manufacturing
  • Automatic
  • Electric
  • Servo Drive
  • Wave Soldering, Lead-Free Compatible
  • Room Temperature (Preheat: 80-180C, Solder Pot: Max 300C)
  • Wave Solder Machine
  • 380V/220V, 3 Phase
  • 13 KW
  • Reinforced Steel Structure
  • Forced Air Cooling
  • Powder Coated
  • 400W AC Motor
  • Energy Efficient, Easy Maintenance, Lead-Free Compatibility, High Reliability
  • Approx. 600 kg
  • 2400 mm x 1200 mm x 1600 mm
  • Wave Soldering Machine
  • White/Grey
  • 13 KW
  • RS-232, USB (Optional)
  • 0.1 mm
  • WSM 350 DC
  • Automatic
  • 50/60 Hz
  • <65 dB
  • 400-800 PCB/Hr
  • Atmospheric
  • PLC with Touch Screen Interface
  • <10 Minutes
  • Emergency Stop, Overload Protection, Door Interlock
  • Electronic
  • Hot Air/Infrared
  • 350 Kg
  • Titanium (Lead-Free Safe)
  • Integrated After Soldering
  • 350 mm
  • 7" Touch Screen
  • 5-7 Bar
  • Optional
  • Spray/Sponge (Adjustable Flow)
  • 3-7 Adjustable
  • Automatic Alerts on Display

Product Description

Product Details:
Minimum Order Quantity1 Piece
Wave Width310
Automation GradeAutomatic
Input Voltage440V
BrandEstovir
Conveyor Angle4 Degree-8 Degree
Conveyor Height750+/-20 (mm)
Conveyor SpeedMax 2.5 m/min (Normal 0.8 mtr/min)
Cooling System2 Air Fan cooling
Dimensions3350 x 1280 x 1750 mm
FingerSpecial Steel wiith hook (Optional: Tiitanium Finger)
Flux Bath capacity4 Ltr.
Foam Height10 mm
Foam width14 mm
Air Pressure40 PSI
Candle Pipe2-5 micron
Control ModePID SSR
Control SystemTouch Screen + PLC
Warm-up Time15 min (150 DegreeC setting)
Wave Height0-8 mm
Wave TypeDual Wave Carrier Type
Weight520 Kg
PCB Width60 -340mm
Power Supply440V AC, 50Hz, 3 Phase, 5 wires
Pre Heater Power3.6 KW
Preheating MethodHeating Element
Preheating Zones / Length1200 mm
Solder Bath Power8.2 KW
solder pot capacity260 Kg
Solder Pot MaterialSpecial Steel high grade
Solder Pot styleMechanical Motor drive
Start-up Power14 kW
Country of OriginMade in India
Power Consumption8 KW
Model Name/NumberWSM 300 DC
Operating Power7 kW


Advanced Control for Precise Soldering

Equipped with a modern PLC and 7-inch touch screen interface, the WSM 350 DC provides operators full control over every process variable. Electronic wave height adjustment and precise conveyor angle setup ensure flexible handling of various PCB designs. The intuitive display also supports real-time monitoring, error alerts, and easy switching between production jobs, making the workflow seamless and highly precise.


Flexible and Lead-Free Safe Operation

The machine features a titanium solder pot compatible with lead-free soldering, meeting modern environmental and quality standards. Its dual flux system-spray or sponge applicator with adjustable flow-caters to diverse assembly requirements, while the preheating zone adapts with hot air or infrared technology. This flexibility allows manufacturing operations to be tailored for different product types, improving both efficiency and product quality.


Integrated Safety and Maintenance Features

Safety in operation is ensured through emergency stop, overload protection, and interlocked doors, minimizing risk. Automatic maintenance indication on the display provides timely alerts, reducing downtime and ensuring continuous, reliable performance. The robust, powder-coated frame and efficient forced air cooling keep the machine running optimally even in intensive production cycles, while changeovers take less than 10 minutes to maximize throughput.

FAQ's of Wave Soldering Machine WSM 350 DC (Carrier Types):


Q: How does the WSM 350 DC ensure consistent and reliable soldering quality?

A: The machine maintains soldering consistency through electronic wave height adjustment, servo-driven conveyor control, and precise preheating via hot air or infrared. Its PLC system enables accurate parameter settings, and the titanium solder pot supports both leaded and lead-free processes, guaranteeing optimal solder flow and quality across different PCB types.

Q: What is the typical process flow for operating the WSM 350 DC wave soldering machine?

A: The process begins with applying flux via adjustable spray or sponge systems, followed by preheating using hot air or infrared. PCBs are then conveyed over the wave-solder pot at electronic adjustable heights. The integrated cooling section solidifies solder joints post-waving, and all steps are monitored and controlled via the touch screen PLC interface.

Q: When should maintenance be performed on the WSM 350 DC, and how is this indicated?

A: Maintenance schedules are determined automatically by the machine's built-in monitoring system, which issues alerts on the 7" touch screen display. The system notifies operators of required maintenance tasks, ensuring preventative action is taken before potential issues arise, thus minimizing machine downtime and maintaining high productivity levels.

Q: Where is the WSM 350 DC commonly used, and what types of applications does it support?

A: This model is ideal for use in electronic manufacturing environments, including PCB assembly lines and facilities producing consumer, industrial, or automotive electronics. With a capability of soldering up to 800 PCBs per hour and handling PCBs up to 350 mm wide, it suits high-volume applications requiring reliability, speed, and lead-free compatibility.

Q: What are the benefits of the WSM 350 DC's dual preheating system?

A: The dual preheating system offers a choice between hot air and infrared, allowing process engineers to optimize thermal profiles for diverse board materials and soldering requirements. This flexibility supports complex assemblies and reduces the risk of thermal damage, ensuring strong solder joints and high product yields.

Q: How does the nitrogen system and integrated cooling feature enhance machine performance?

A: The optional nitrogen system reduces oxidation during soldering, leading to improved joint reliability and cosmetic appearance, especially important for lead-free solders. The integrated forced air cooling section rapidly solidifies solder joints post-wave, preventing defects and enabling faster handling of completed assemblies.

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