Product Description
FEATURES
PLC Control System to ensure working stabilized reliable Touch
screen is easy to operate
High Rigidity structure and linear rails ensure the stabilities and
precision of pinting
This printer can automatically set the running parameters to comport
with all kind of products and get best performance according to
different characteristic of glue and solder paste
Flexible arming base with the arms can be adjusted toward ight or left
to match different size of PCB
The printing knife can be rotated 45X upward then fixed to convenient
for the clean replace of knife and stencils Calibration method is to use the movement of stencil to match with X Y Z of printing base
SPECIFICATIONS
Mode ET680SP ET740SP
Features
Description Suitable for printing solder paste and glue for all kinds of
thick or thin PCB Single or Double
Power Requirement 220VAC50HZ 1 Phase
Power Consumption 100 W
PCB Thickness Range 02 30 mm
Fine Adjustment of Platform 005 mm
Respectable Precision 0 002 mm
Air Supply 4 6 Kgcm sq
Printing Plat form 320 x 500 mm 320 x 500 mm
Stencil Dimension 370 x 470 to 370x 470 to
550 x 650 mm 736 x 736 mm
PCB Dimension 320 x 450 mm 320 x 500 mm
PCB Positioning Method Positioning Pin Positioning Pin
Printing Method Stencil Movement Stencil Movement
Dimension L880 W680 L1000W870
H1650 mm H1650 mm
Weight 220 Kg 260 Kg