Wave Soldering Machine WSM 200 SC (Carrier Type)

Product Description

Wave Soldering Machine – 200 SC (Carrier Type)

Overview
The Wave Soldering Machine – 200 SC (Carrier Type) is a high-performance single-wave soldering system for PCB mass production. It delivers reliable soldering for through-hole and selective SMD components with consistent joints, high throughput, and minimal defects. With precise temperature control, robust conveyors, and titanium alloy solder pot, it supports lead-free processes. Ideal for automotive, consumer, telecom, industrial, and medical electronics.

Benefits

• High Productivity: Faster throughput, reduced cycle times.

• Consistent Quality: Defect-free joints, less human error.

• Lead-Free Ready: Durable titanium solder pot.

Key Features

• Single-Wave Tech: Reduces bridging/skips, ensures coverage.

• PLC + HMI: Real-time monitoring, easy digital control.

• PID + SSR Heating: Stable solder bath & preheaters, energy efficient.

• Automatic Conveyor (200 mm): Smooth vibration-free PCB transport.

• Foam Fluxer: 2–10 µm candle with auto economy mode.

• Titanium Solder Pot (215 kg, 300°C): Corrosion-resistant, long life.

• Ceramic Preheater (800 mm): Even heating, insulated for efficiency.

• 2 Air Fans Cooling: Prevents cracks, ensures durability.

• Finger Cleaning System: Keeps contact clean, prevents contamination.

• Pneumatic Control: Pressure gauge + solenoid valve for precise flux spraying.

Main Parts

1. Solder Bath: Steel, SMT/Lambda nozzles, PID + PLC control, reduced dross.

2. Pre-Heater: 800 mm ceramic zone, even heating, PID stable.

3. Fluxer & Knife: ROHS-compliant, economy mode, independent control.

4. Conveyor: Chain type, aluminium, AC motor + VFD.

5. PCB Carrier: Aluminium with steel/titanium fingers, adjustable.

6. Control Panel: PLC + HMI, VFD motors, MCBs & relays.

7. Pneumatic System: Gauge + solenoid valve for air/flux control.

Process Parameters

• Preheating: Up to 85°C to avoid thermal shock.

• Wetting Time: Strong solder-pad adhesion.

• Dwell Time: 2–4 s for reliable joints.

• Soldering Time: 5–10 s defect-free soldering.

• Cooling: Forced-air prevents cracks & stress.

Applications

• PCB Lines: Reliable soldering at scale.

• Consumer: TVs, gadgets, appliances.

• Automotive: ECUs, dashboards, sensors.

• Industrial: Power boards, automation systems.

• Telecom: Routers, switches, modules.

• Medical: Diagnostic & precision devices.

Advantages

• Optimized speed for mass production.

• Defect-free, consistent solder joints.

• Low energy costs with PID heating.

• Long-life solder pot (steel/titanium).

• User-friendly PLC + HMI interface.

• Reduced downtime & maintenance.

• Supports varied PCB sizes/components.

• Ensures durable, high-reliability joints.